Author:
Su Yutai,Fu Guicui,Liu Changqing,Liu Canyu,Long Xu
Funder
EPSRC
China Scholarship Council
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference12 articles.
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3. Mechanical effects of isolated defects within a lead-free solder bump subjected to coupled thermal-electrical loading;Long;Journal of Micromechanics and Molecular Physics.,2016
4. Comparative thermal and structural characterization of sintered Nano-silver and high-Lead solder die attachments during power cycling;Dai;IEEE Trans. Device Mater. Reliab.,2018
5. Reverse analysis of constitutive properties of sintered silver particles from nanoindentations;Long;Int. J. Solids Struct.,2020
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