Author:
Yoon DongGwan,Sim JaeMin,Song YunHeub
Funder
Ministry of Science, ICT and Future Planning
National Research Foundation of Korea
Samsung
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference22 articles.
1. Evolution of NAND flash memory: From 2D to 3D as a storage market leader;Kim,2017
2. NAND flash memory: challenges and opportunities;Li;Computer,2013
3. A 176-stacked 512Gb 3b/Cell 3D-NAND flash with 10.8 Gb/mm 2 density with a peripheral circuit under cell array architecture;Park,2021
4. The grand challenges of plasma etching: a manufacturing perspective;Lee;J. Phys. D. Appl. Phys.,2014
5. Technology scaling challenges and opportunities of memory devices;Seok-Hee,2016
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献