1. Future on-chip interconnect metallization and electromigration;Hu;IRPS,2018
2. Interconnect trend for single digit nodes;Naik;IEDM Tech Dig,2018
3. Mechanisms of electromigration damage in Cu interconnects;Hu;IEDM Tech Dig,2018
4. Reliability study on cobalt and ruthenium as alternative metals for advanced interconnects;Varela Pedreira;IRPS,2017
5. Cobalt bottom-up contact and via prefill enabling advanced logic and DRAM technologies;van der Veen;IITC,2015