Impact of inter-metallic compound thickness on thermo-mechanical reliability of solder joints in solar cell assembly-Reference-Cited by-同舟云学术

Impact of inter-metallic compound thickness on thermo-mechanical reliability of solder joints in solar cell assembly

Published:2021-01 Issue: Volume:116 Page:114008
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Zarmai Musa T.,Oduoza Chike F.

Funder

Petroleum Technology Development Fund

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference18 articles.

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3. Durability of Pb-free solder between copper interconnect and silicon in photovoltaic cells;Cuddalorepatta;Prog. Photovolt. Res. Appl.,2010

4. Reliability modeling for photovoltaic modules;McCluskey,2010

5. Zarmai, M.T. (2016) Modelling of Solder Interconnection's Performance in Photovoltaic Modules for Reliability Prediction, University of Wolverhampton. [accessed April 3, 2019]. Available at: https://wlv.openrepository.com/handle/2436/617782 (Online, PhD. Thesis).

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