Durability of Pb-free solder between copper interconnect and silicon in photovoltaic cells-Reference-Cited by-同舟云学术

Durability of Pb-free solder between copper interconnect and silicon in photovoltaic cells

Published:2010-03-11 Issue:3 Volume:18 Page:168-182
ISSN:1062-7995
Container-title:Progress in Photovoltaics: Research and Applications
language:en
Short-container-title:Prog. Photovolt: Res. Appl.

Author:

Cuddalorepatta Gayatri,Dasgupta Abhijit,Sealing Scott,Moyer Jerome,Tolliver Todd,Loman James

Funder

General Electric-GRC

General Electric-Energy

CALCE Electronic Products and Systems Consortium at the University of Maryland, College Park

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/pip.944/fullpdf

Reference37 articles.

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3. Photovoltaic module performance and durability following long-term field exposure;King;Progress in Photovoltaics: Research and Applications,2000

4. Saly V Ruzinsky M Packa J Redi P Examination of solar cells and encapsulations of small experimental photovoltaic modules IEEE Polytronic Conference 2002 137 141

5. King DL Hansen BR Kratochvil JA Quintana MA Dark current-voltage measurements on photovoltaic modules as a diagnostic or manufacturing tool 26th IEEE Photovoltaic Specialists Conference 1997

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