Multiscale simulation of aluminum thin films for the design of highly-reliable MEMS devices-Reference-Cited by-同舟云学术

Multiscale simulation of aluminum thin films for the design of highly-reliable MEMS devices

Published:2009-09 Issue:9-11 Volume:49 Page:1278-1282
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Kubo Haruka,Ciappa Mauro,Masunaga Takayuki,Fichtner Wolfgang

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference7 articles.

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3. Plasticity size effects in free-standing submicron polycrystalline FCC films subjected to pure tension;Espinosa;J Mech Phys Solids,2004

4. Comparison of electrical and microtensile evaluations of mechanical properties of an aluminum film;Barbosa;Metall Mater Trans A,2007

5. A multiscale mechanics approach for modeling textured polycrystalline thin films with nanothickness;Zhang;Int J Mech Sci,2006

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