Author:
Felczak M.,Więcek B.,De Mey G.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference17 articles.
1. Component placement for reliability on conductively cooled printed wiring boards;Osterman;J Electron Packag,1989
2. Thermal placement in hybrid circuits – a heuristic approach;Kos;Active Passive Electron Compon,1994
3. The thermal wake function for rectangular electronic modules;Kang;J Electron Packag,1994
4. Wirtz RA, Dykshoorn P. Heat transfer from arrays of flat packs in a channel flow. In: Proceedings of the 4th IEPS conference. Baltimore; 1984. p. 318–26.
5. Forced air cooling of low profile air cooling;Wirtz,1996
Cited by
12 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献