Numerical investigation of solder joint shape for micro-spring package during vacuum vapor phase soldering-Reference-Cited by-同舟云学术

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Numerical investigation of solder joint shape for micro-spring package during vacuum vapor phase soldering

Published:2024-04 Issue: Volume:155 Page:115359
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Li Xiaomin,Wu Ping

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Reference32 articles.

1. Vibration and thermal fatigue reliability of CCGA components;Lu,2019

2. Reliability of column/board/CCGA attachment;Ghaffarian,2012

3. Coupling effects of mechanical vibrations and thermal cycling on reliability of CCGA solder joints;Ding;Microelectron. Reliab.,2015

4. R. Ghaffarian, Thermal cycle reliability of PBGA/CCGA 717 I/Os. 56th Electronic Components and Technology Conference, 2006, pp. 13.

5. Solder Columns for CCGA Ceramics Substrates;Hart,2014

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