Coupling effects of mechanical vibrations and thermal cycling on reliability of CCGA solder joints-Reference-Cited by-同舟云学术

Coupling effects of mechanical vibrations and thermal cycling on reliability of CCGA solder joints

Published:2015-11 Issue:11 Volume:55 Page:2396-2402
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Ding Ying,Tian Ruyu,Wang Xiuli,Hang Chunjin,Yu Fang,Zhou Ling,Meng Xiangang,Tian Yanhong

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference17 articles.

1. Ceramic column grid array for flip chip applications;Master,1995

2. Vibration-induced solder joint failure of a ceramic column grid array (CCGA) package;Perkins,2004

3. High-g shock reliability of ceramic area-array packages;Lall,2012

4. CCGA packages for space applications;Ghaffarian;Microelectron. Reliab.,2006

5. Life testing of reflowed and reworked advanced CCGA surface mount packages in harsh thermal environments;Ramesham,2013

Cited by 24 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Microstructural response characteristics of SAC305/Cu column joint under friction embedded welding conditions;Materials Characterization;2024-05

2. Numerical investigation of solder joint shape for micro-spring package during vacuum vapor phase soldering;Microelectronics Reliability;2024-04

3. Solder joint shape optimization and thermal-mechanical reliability improvement for microwave RF coaxial connectors;Microelectronics Reliability;2024-03

4. Numerical Simulation of Harmonic Response Analysis for Small Out-Line Package;2024 Asia-Pacific Conference on Software Engineering, Social Network Analysis and Intelligent Computing (SSAIC);2024-01-10

5. Study on the Design of Thermal Vibration Integrated Reliability Enhancement test Profile based on Multi-stress Failure Excitation Simulation;2023-11-07