X-ray inspection of TSV defects with self-organizing map network and Otsu algorithm-Reference-Cited by-同舟云学术

X-ray inspection of TSV defects with self-organizing map network and Otsu algorithm

Published:2016-12 Issue: Volume:67 Page:129-134
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Shen Junjie,Chen Pengfei,Su Lei,Shi Tielin,Tang Zirong,Liao Guanglan

Funder

National Key Basic Research Special Fund of China

National Natural Science Foundation of China

Program for Changjiang Scholars and Innovative Research Team in University

Natural Science Foundation of Jiangsu Province

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference27 articles.

1. Materials challenges in three-dimensional integrated circuits;Chen;MRS Bull.,2015

2. 3D integration technology: status and application development;Ramm,2010

3. Through-silicon via stress characteristics and reliability impact on 3D integrated circuits;Jiang;MRS Bull.,2015

4. Three-dimensional integration: An industry perspective;Iyer;MRS Bull.,2015

5. 3-D hyperintegration and packaging technologies for micro-nano systems;Lu;Proc. IEEE,2009

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