Author:
Bianic Stephane,Allemand Stéphanie,Kerrosa Grégory,Scafidi Pascal,Renard Didier
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference4 articles.
1. Die repackaging for failure analysis, ESREF 2006;Barberan;Microelectronics Reliability,2005
2. Kasapi S, Cory B. Overcoming fault test coverage with time-resolved emission (TRE) probing. ESREF 2004.
3. Ispasoiu R, Crawford T, Johnston B, Shaw C, Kasapi S, Goertz J. et al., Reduction of the time acquisition for CMOS time-resolved photon emission by optimized IR detection. ESREF 2006.
4. Impact of back side circuit edit on active device performance in bulk silicon ICs by C. Boit and all (International test conference 0-7803-9039-3/$20.00 © 2005 IEEE).
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4 articles.
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