Author:
Kim Hak Sung,Song Ho Geon
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference8 articles.
1. Hygrocopic swelling and sorption characteristics of epoxy molding compounds used in electronic packaging;Ardebili;IEEE Trans Comp Packag Technol,2003
2. Comprehensive treatment of moisture induced failure-recent advances;Wong;IEEE Trans Elec Pack Man,2002
3. Wong EH, et al. Moisture diffusion and vapor pressure modeling of IC packaging. In: Proceedings of the 48th Elec Comp and Tech Conf, 1998. p. 1372–8.
4. Evaluation of interfacial fracture toughness of a flip-chip package and a biomaterial system by a combined experimental and numerical method;Wang;Eng Frac Mech,1999
5. Tee TY, et al., Whole field vapor pressure modeling of QFN during Reflow with coupled hygro-mechanical and thermo-mechanical stresses. In: Proceedings of the 52th Elec. Comp. and Tech. p. 1552–9.
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