Dynamical IMC-growth calculation-Reference-Cited by-同舟云学术

Dynamical IMC-growth calculation

Published:2015-08 Issue:9-10 Volume:55 Page:1832-1837
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Meinshausen L.,Weide-Zaage K.,Frémont H.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference14 articles.

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3. Reliability challenges in 3D IC packaging technology;Tu;Microelectron. Reliab.,2011

4. 10μm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack;Ohara,2009

5. Reliability testing of Cu–Sn intermetallic micro-bump interconnections for 3D-device stacking;Labie,2010

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2. Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints;Materials;2022-07-21

3. Impact of temperature on the corrosion of lead-free solder alloy during salt spray test;Microelectronics Reliability;2021-11

4. An analytical model to predict diffusion induced intermetallic compounds growth in Cu-Sn-Cu sandwich structures;Theoretical and Applied Mechanics Letters;2020-01

5. Electromigration behavior of Cu/Sn3.0Ag0.5Cu/Cu ball grid array solder joints;Journal of Materials Science: Materials in Electronics;2019-02-19