Breakdown data generation and in-die deconvolution methodology to address BEOL and MOL dielectric breakdown challenges-Reference-Cited by-同舟云学术

Breakdown data generation and in-die deconvolution methodology to address BEOL and MOL dielectric breakdown challenges

Published:2015-12 Issue:12 Volume:55 Page:2727-2747
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Chen F.,Graas Carole,Shinosky Michael,Zhao Kai,Narasimha Shreesh,Liu Xiao Hu,Tian Chunyan

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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