A robust electro-thermal IGBT SPICE model: Application to short-circuit protection circuit design-Reference-Cited by-同舟云学术

A robust electro-thermal IGBT SPICE model: Application to short-circuit protection circuit design

Published:2015-08 Issue:9-10 Volume:55 Page:1971-1975
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Cavaiuolo D.,Riccio M.,Maresca L.,Irace A.,Breglio G.,Daprà D.,Sanfilippo C.,Merlin L.

Funder

MIUR

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference14 articles.

1. Applied Power Electronics Conference and Exposition, IEEE APEC;Zhiqiang,2013

2. Power Electronics Specialists Conference, 2008. PESC 2008. IEEE. IEEE;Arab,2008

3. Power Electronics Conference (IPEC), 2010 International. IEEE;Kovacevic,2010

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Circuit Simulation Method for Insulated-Gate Bipolar Transistor Short-Circuit Operation with High Accuracy;IEEJ Journal of Industry Applications;2023-07-01

2. Circuit Simulation Method for Insulated-Gate Bipolar Transistor Short-Circuit Operation with High Accuracy;IEEJ Transactions on Industry Applications;2022-12-01

3. EM-Electrothermal Analysis of Semiconductor Power Modules;IEEE Transactions on Components, Packaging and Manufacturing Technology;2019-08

4. Model-Order Reduction Procedure for Fast Dynamic Electrothermal Simulation of Power Converters;Lecture Notes in Electrical Engineering;2018-07-13

5. Accurate SPICE Modeling of Reverse-Conducting IGBTs Including Self-Heating Effects;IEEE Transactions on Power Electronics;2017-04