Failures on DC–DC modules following a change of wire bonding material from gold to copper-Reference-Cited by-同舟云学术

Failures on DC–DC modules following a change of wire bonding material from gold to copper

Published:2015-08 Issue:9-10 Volume:55 Page:2003-2006
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Belfort Y.^ORCID,Caignard J.-M.,Keller S.,Guerveno J.-P.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference5 articles.

1. Acid Decapsulation of Epoxy Molded IC Packages With Copper Wire Bonds;Sarangapani Murali and Narasimalu Srikanth,2006

2. Takashi Yamada Improving Humidity Bond Reliability of Copper Bonding Wires;Tomohiro Uno,2010

3. The Interface Behavior of the Cu–Al Bond System in High Humidity Conditions;Kim,2010

4. Effect of Moisture and Temperature on Al–Cu Interfacial Strength;Teng,2008

5. Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability;Kim,2001

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