Study of the temperature distribution in insulated gate bipolar transistor module under different test conditions-Reference-Cited by-同舟云学术

Study of the temperature distribution in insulated gate bipolar transistor module under different test conditions

Published:2023-01 Issue: Volume:140 Page:114880
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Zhao Di,Guo Chunsheng,Li Yumeng,Pan Shijie,Feng Shiwei,Zhu Hui

Funder

State Grid Corporation of China

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference14 articles.

1. Z. Zhao , et al. "Overview of the developments on high power electronic technologies and applications in China." J. Electr. Eng.

2. Analysis of future development of HVDC power grid;Yao;Proc. CSEE,2014

3. Study on case temperature distribution for condition monitoring of multidie IGBT modules;Tian,2014

4. Healthy evaluation on IGBT solder based on electro-thermal-mechanical analysis;Chen;Trans. China Electrotechnical Soc.,2015

5. Influences of chip packaging parameters on thermal characteristics of power modules;Yuan;J. Power Supply,2016

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Multiphysics modeling and experimental analysis of corrosion-assisted degradation in industrial pressure transducer packages under thermomechanical fatigue;Materials Chemistry and Physics;2024-10

2. IoT-Based IGBT Power Module Health Monitoring System With RUL Estimation for Electric Drive Applications;IEEE Access;2024

3. Measurement Deviation of the Virtual Junction Temperature by the Saturation Voltage Drop Method for Insulated-Gate Bipolar Transistors;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-12

4. Analysis of inhomogeneous temperature distribution in power modules for different cooling systems and the influence on lifetime consumption;2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe);2023-09-04

5. Effect of liquid metal enhanced Cu nano/micro particle paste on performance of Cu-Cu joints;Materials Today Communications;2023-08