Author:
Herrmann A.,Erich S.J.F.,van der Ven L.G.J.,Huinink H.P.,van Driel W.D.,van Soestbergen M.,Mavinkurve A.,De Buyl F.,Fischer H.R.,Mol J.M.C.,Adan O.C.G.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Cited by
2 articles.
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1. Optical Properties of Nanofillers;Handbook of Nanofillers;2024
2. Effect of the toughening agent and coupling agent on the Liquid Epoxy Molding Compound;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08