Effect of the toughening agent and coupling agent on the Liquid Epoxy Molding Compound-Reference-Cited by-同舟云学术

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Effect of the toughening agent and coupling agent on the Liquid Epoxy Molding Compound

Published:2023-08-08 Issue: Volume: Page:1-4
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
language:
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Author:

Wei Chunxiang¹,Liu Mingqiang¹,Liu Xin¹,Luo Yanjie¹,Zhu Pengli²,Ai Wenji³

Affiliation:

1. Shenzhen Institute of Advanced Electronic Materials,Shenzhen,China

2. Chinese Academy of Sciences,Shenzhen Institute of Advanced Electronic Materials Shenzhen Institute of Advanced Technology,Shenzhen,China

3. Guangzhou Railway Polytechnic,Guangzhou,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492101.pdf?arnumber=10492101

Reference10 articles.

1. Toughening of dicyandiamide-cured DGEBA-based epoxy resin using MBS core-shell rubber particles

2. The Effect of Epoxy Molding Compound Floor Life to Reliability Performance and mold ability for QFN Package

3. Chemical shrinkage and diffusion-controlled reaction of an epoxy molding compound

4. Adhesion between Ni/Fe lead frame and epoxy molding compounds in IC packages

5. Synthesis and research of epoxy resin toughening agent

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