Modified Norris-Landzberg model for Pb-free solder joint reliability evaluation-Reference-Cited by-同舟云学术

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Modified Norris-Landzberg model for Pb-free solder joint reliability evaluation

Published:2022-08 Issue: Volume:135 Page:114590
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Xie Weidong

Funder

Cisco Systems

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference36 articles.

1. Reliability of controlled collapse interconnections;Norris;IBM J. Res. Dev.,1969

2. Modeling temperature cycle fatigue life of select SAC solders;Osterman,2018

3. Acceleration factors for lead-free solder materials;Salmela;IEEE Trans. CPT,2007

4. The investigation of modified Norris-Landzberg acceleration models for reliability assessment of ball grid array packages;Chung,2010

5. Characteristic life based acceleration transforms for lead-free solder joint reliability under thermal cycling conditions;Ahmad,2010

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Acceleration model considering multi‐stress coupling effect and reliability modeling method based on nonlinear Wiener process;Quality and Reliability Engineering International;2024-05-06

2. A reliability evaluation method of complex electromechanical products based on the multi-stress coupling acceleration model;Engineering Failure Analysis;2023-04

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