Towards development of an intelligent failure analysis system based on infrared thermography-Reference-Cited by-同舟云学术

Towards development of an intelligent failure analysis system based on infrared thermography

Published:2022-12 Issue: Volume:139 Page:114823
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Pareek Kaushal Arun,May Daniel,Ras Mohamad Abo,Wunderle Bernhard

Funder

European Social Fund

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference31 articles.

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4. Automatic algorithm for quantitative pulsed phase thermography calculations;Ibarra-Castanedo,2004

5. QuantitativeSubsurface Defect Evaluation by Pulsed Phase Thermography: Depth Retrieval Withthe Phase;Castanedo,2005

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