Author:
Silomon Jendrik,Chimeg Dulguun,Gluch Jürgen,Clausner André,Zschech Ehrenfried
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference7 articles.
1. Crack identification and evaluation in BEoL stacks of two different samples utilizing acoustic emission testing and nano X-ray computed tomography;Silomon;Microelectron. Reliab.,2021
2. Micromechanical BEoL Robustness Evaluation Methods Enabling Loading Condition Customization and Acoustic Emission Damage Monitoring, Methods X;Silomon,2022
3. JEDEC Solid State Technology Association,2014
4. Impact of back.End-of-line architecture on chip-package-interaction in advanced interconnects;Vanstreels;Microelectron. Reliab.,2020
5. Experimental analyses of the mechanical reliability of advanced BEOL/fBEOL stacks regarding CPI loading;Geisler,2013
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献