1. Experimental analyses of the mechanical reliability of advanced BEOL/fBEOL stacks regarding CPI loading;Geisler,2013
2. Advanced chip package interaction qualification for critical stacks in combi- nation with Cu pillar interconnect technology;Boehme,2016
3. Qualification of bumping processes: experimental and numerical investigations on mechanical stress and failure modes induced by shear test;Gallois;Microelectron. Reliab.,2015
4. JEDEC Standard JESD22-B117B, JEDEC solid state technology association, May 2014
5. BEoL stack robustness investigations utilizing Cu pillar immobilization and micromechanical loading methods;Silomon;Microelectron. Reliab.,2022