Tilt- and warpage measurement as inline quality assessment tool-Reference-Cited by-同舟云学术

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Tilt- and warpage measurement as inline quality assessment tool

Published:2022-08 Issue: Volume:135 Page:114601
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

May D.,Heilmann J.,Boschman E.,Abo Ras M.,Wunderle B.

Funder

European Commission

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference14 articles.

1. Identifying the development state of sintered silver (Ag) as a bonding material in the microelectronic packaging via a patent landscape study;Siow;J. Electron. Packag.,2016

2. Reliability experiments of sintered silver based interconnections by accelerated isothermal bending tests;Heilmann;Microelectron. Reliab.,2017

3. Reliability assessment of sintered nano-silver die attachment for power semiconductors;Knoerr,2010

4. Reliability of Ag sintering for power semiconductor die attach in high-temperature applications;Yu;Trans.Power Electron.,2017

5. Microelectronics Failure Analysis;Ross,2011

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