Optimization of Ag-alloy ribbon bonding — An approach to reliable interconnection for high power IC packaging-Reference-Cited by-同舟云学术

Optimization of Ag-alloy ribbon bonding — An approach to reliable interconnection for high power IC packaging

Published:2022-10 Issue: Volume:137 Page:114786
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Chen Chun-Hao,Chuang Tung-Han

Funder

Ministry of Science and Technology, Taiwan

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference30 articles.

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