Author:
Bergers L.I.J.C.,Hoefnagels J.P.M.,Delhey N.K.R.,Geers M.G.D.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference22 articles.
1. MEMS reliability from a failure mechanisms perspective;van Spengen;Microelectron Reliab,2003
2. Mechanical fatigue of thin copper foil;Merchant;J Electron Mater,1999
3. Creep as a reliability problem in mems;Modlinski;Microelectron Reliab,2004
4. van Gils M, Bielen J, McDonald G. Evaluation of creep in RF-MEMS devices. In: Proc. 8th int. conf. on therm., mech., and multiphys., sim. and exp. in microelectron. and micro-syst (EuroSimE); 2007. p. 1–6.
5. Douglas MR. Lifetime estimates and unique failure mechanisms for a digital micromirror device (DMD). In: Proc. IEEE int. reliab. phys. symp.; 1998. p. 9–16.
Cited by
20 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献