BCB-to-oxide bonding technology for 3D integration

Author:

Lin S.L.,Huang W.C.,Ko C.T.,Chen K.N.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference12 articles.

1. Hua H, Mineo C, Schoenfliess K, et al. Exploring compromises among timing, power and temperature in three-dimensional integrated circuits. In: Proceedings of the 43rd annual design automation conference DAC; 2006.

2. Niklaus F, Lu JQ, McMahon JJ, et al. Wafer-Level 3D integration technology platforms for ICs and MEMS. In: Proceedings of the 20th international VLSI; 2005.

3. Jourdain A, Soussan P, Swinnen B, et al. Electrically yielding collective hybrid bonding for 3D stacking of ICs. In: Electronic components and technology conference; 2009.

4. Chan KC, Teo M, Zhong ZW. Characterization of low-k benzocyclobutene dielectric thin film. In: Microelectronics international; 2003. p. 11–22.

5. Scheck D, Rogers B, Garrou P, Dibbs M. Pre-develop bake for end point stabilization with photo-BCB polymers. In: International symposium on advanced packaging materials; 1998. p. 82–7.

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