Corrosion behavior, whisker growth, and electrochemical migration of Sn–3.0Ag–0.5Cu solder doping with In and Zn in NaCl solution-Reference-Cited by-同舟云学术

Corrosion behavior, whisker growth, and electrochemical migration of Sn–3.0Ag–0.5Cu solder doping with In and Zn in NaCl solution

Published:2011-12 Issue:12 Volume:51 Page:2274-2283
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Hua L.,Yang C.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference51 articles.

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4. US Environmental Protection Agency. Comprehensive review of lead in the environment under TSCA, 56FR22096-98, 13 May, 1991.

5. Cleaning Stainless Steel Surfaces to Improve the Adhesion of Photoresist Coatings

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