Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs)-Reference-Cited by-同舟云学术

Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs)

Published:2012-01 Issue:1 Volume:52 Page:225-234
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Suk Kyoung-Lim,Son Ho-Young,Chung Chang-Kyu,Kim Joong Do,Lee Jin-Woo,Paik Kyung-Wook

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference12 articles.

1. Fundamentals of microsystems packaging;Tummala,2001

2. Advanced packaging: the redistributed chip package;Keser;IEEE Trans Adv Pack,2008

3. 3D chip stack technology using through-chip interconnects;Benkart;IEEE Des Test Comput,2005

4. Foldable flex and thinned silicon chip packaging technology;Blade,2002

5. Anisotropic conductive film flip chip joining using thin chips;Jokinen;Microelectron Reliab,2002

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Metal oxide heterostructure-based light-emitting diodes;Metal Oxide-Based Heterostructures;2023

2. Aero Acoustic MEMS Microphone Integration in Ultra-Thin and Flexible Substrate;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

3. Fundamentals of LEDs;The Fundamentals and Applications of Light-Emitting Diodes;2021

4. A review on the advancements in phosphor-converted light emitting diodes (pc-LEDs): Phosphor synthesis, device fabrication and characterization;Progress in Materials Science;2020-04

5. Micro Light‐Emitting Diodes for Display and Flexible Biomedical Applications;Advanced Functional Materials;2019-04-03