High power LED package with vertical structure

Author:

Lin Ming-Te,Ying Shang-Ping,Lin Ming-Yao,Tai Kuang-Yu,Chen Jyh-Chen

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference18 articles.

1. Mehmet A, James P, Stanton W. Thermal challenges in the future generation solid state lighting applications: light emitting diodes. In: 2002 Inter society conf on thermal phenomena; 2002. p. 113–20.

2. James P. Thermal challenges facing new generation light emitting diodes (LED) for lighting applications. In: Proc SPIE 4776; 2002. p. 215–22.

3. High power LEDs – technology status and market applications;Steranka;Phys Status Solidi A,2002

4. Frank W, Paul SM, Gerard H. High power LED package requirements. In: Proc SPIE 5187; 2004. p. 85–92.

5. Moo Whan Shin. Thermal design of high-power LED package and system. In: SPIE 6355; 2006. p. 635509-1–13.

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