Fabrication of Al-Based Metal Printed Circuit Board Having Excellent Heat Dissipation Characteristics Using Polyimide/AlN Powder and Evaluation of Thermal Resistance of Light-Emitting Diode Module
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Published:2016-10-01
Issue:10
Volume:16
Page:10602-10606
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ISSN:1533-4880
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Container-title:Journal of Nanoscience and Nanotechnology
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language:en
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Short-container-title:j nanosci nanotechnol
Author:
Park Jung-Kab,Baek Seung-Bin,Park Jong-Hwan,Suh Su-Jeong
Publisher
American Scientific Publishers
Subject
Condensed Matter Physics,General Materials Science,Biomedical Engineering,General Chemistry,Bioengineering