Energetics of porous amorphous low-k SiOCH dielectric films-Reference-Cited by-同舟云学术

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Energetics of porous amorphous low-k SiOCH dielectric films

Published:2019-12 Issue: Volume:139 Page:105885
ISSN:0021-9614
Container-title:The Journal of Chemical Thermodynamics
language:en
Short-container-title:The Journal of Chemical Thermodynamics

Author:

Chen Jiewei,Calvin Jason J.,King Sean W.,Woodfield Brian F.,Navrotsky Alexandra

Funder

Alfred P. Sloan Foundation

U.S. Department of Energy

Intel Corporation

Publisher

Elsevier BV

Subject

Physical and Theoretical Chemistry,General Materials Science,Atomic and Molecular Physics, and Optics

Reference33 articles.

1. PECVD low and ultralow dielectric constant materials: From invention and research to products

2. Surface Damage Resistance of Gel-Derived Oxycarbide Glasses: Hardness, Toughness, and Scratchability

3. Silicon oxycarbide glasses: Part I. Preparation and chemistry

4. Silicon oxycarbide glasses: Part II. Structure and properties

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1. Amorphous SiC Thin Films Deposited by Plasma-Enhanced Chemical Vapor Deposition for Passivation in Biomedical Devices;Materials;2024-02-29

2. Computational Analysis of the Effects of Nanoscale Confinement on the Structure of Low-k Dielectric Hybrid Organosilicate Materials;IEEE Transactions on Materials for Electron Devices;2024

3. Dielectric Material Technologies for 2-D Semiconductor Transistor Scaling;IEEE Transactions on Electron Devices;2023-04

4. Ultralow‐ k Amorphous Boron Nitride Based on Hexagonal Ring Stacking Framework for 300 mm Silicon Technology Platform;Advanced Materials Technologies;2022-05-16

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