Ultralow‐ k Amorphous Boron Nitride Based on Hexagonal Ring Stacking Framework for 300 mm Silicon Technology Platform
Author:
Affiliation:
1. R&D Taiwan Semiconductor Manufacturing Company Hsinchu 30075 Taiwan, R. O. C
2. Department of Physics National Central University Taoyuan City 320 Taiwan, R. O. C
3. R&D Annealsys Corporate 139 Rue des Walkyries Montpellier 34000 France
Funder
Ministry of Science and Technology, Taiwan
Publisher
Wiley
Subject
Industrial and Manufacturing Engineering,Mechanics of Materials,General Materials Science
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/admt.202200022
Reference44 articles.
1. IEEE International Roadmap for Devices and Systems2020 https://irds.ieee.org.
2. Reasons for lower dielectric constant of fluorinated SiO2 films
3. Infrared spectroscopy study of low-dielectric-constant fluorine-incorporated and carbon-incorporated silicon oxide films
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