Effects of ZrO2 nanoparticles on the mechanical properties of Sn–Zn solder joints on Au/Ni/Cu pads
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference16 articles.
1. Physics and materials challenges for lead-free solders
2. Lead-free Solders in Microelectronics
3. Oxidation behavior of Sn–Zn solders under high-temperature and high-humidity conditions
4. Evolution of interfacial morphology of Sn–8.5Zn–0.5Ag–0.1Al–xGa/Cu system during isothermal aging
5. Early stage soldering reaction and interfacial microstructure formed between molten Sn–Zn–Ag solder and Cu substrate
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1. Solidification Behavior and Mechanical Properties of Sn-2.5Ag-0.8Cu-0.05Ni-1Bi and Sn-0.75Cu-0.065Ni-1.5Bi Solder Alloys, and Microstructures in Joints Formed Using Them;Korean Journal of Metals and Materials;2024-07-05
2. Microstructure, hardness, electrical, and thermal conductivity of SZCN solder reinforced with TiO2 and ZrO2 nanoparticles fabricated by powder metallurgy method;Journal of Materials Science: Materials in Electronics;2024-06
3. Effect of the addition of Cu6Sn5 nanoparticles on the growth of intermetallic compounds at the interfaces of Sn3.0Ag0.5Cu solder joints;Materials Letters;2024-01
4. Evaluation of the microstructure, thermal, and mechanical characteristics of Sn-9Zn reinforced with Ni and ZrO2 nanoparticles via vacuum melting process;Physica Scripta;2023-09-05
5. Enhancing the tensile properties of Sn-Zn-Ag lead-free solder alloy by loading MgO nanoparticles and irradiation;Journal of Composite Materials;2022-06-28
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