Controlling intermetallic compound formation reaction between Sn and Ni–P by Zn addition
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
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3. Zn diffusion and reflow behaviour of Sn-9Zn and Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solders on a Ni/Cu substrate under IR reflow;Soldering & Surface Mount Technology;2014-04-01
4. Interfacial Reactions in Sn x Zn1−x (Liquid)/Ni(Solid) Couples at 873 K;Journal of Electronic Materials;2012-06-22
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