1. Thermal dissipation analysis and verification of a novel packaging material;Liu;Semiconduct. Tech.,2016
2. Simulation study on thermal characteristics of Cu/Mo laminated composite substrate;Zhang;Microelectronics,2016
3. A study on the thermal properties of Mo-Cu composites as a heat sink material;Eik;J. Korean Soc. Heat Treat.,2003
4. Electrical contact materials obtained by spark plasma sintering technology for vacuum contactors;Tsakiris;9th Int. Symp. Adv. Topics Electr. Eng.,2015
5. Three-dimensional characterization of the permeability of W-Cu composites using a new “TriBeam” technique;Echlin;Acta Mater.,2014