The effect of the deposition rate on morphology, opto-electronic properties and formation intermetallic compounds of Au–Sn alloys-Reference-Cited by-同舟云学术

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The effect of the deposition rate on morphology, opto-electronic properties and formation intermetallic compounds of Au–Sn alloys

Published:2020-12 Issue: Volume:849 Page:156041
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Rerek T.,Skowronski L.,Szczesny R.,Naparty M.K.,Derkowska-Zielinska B.

Funder

Polish Ministry of Science and Higher Education

European Regional Development Fund

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference38 articles.

1. Lead-free solder alloys: Thermodynamic properties of the (Au+Sb+Sn) and (Au+Sb) system;Hindler;J. Chem. Thermodyn.,2012

2. Spontaneous growth of Sn whiskers and a new formation mechanism;Liu;Mater. Lett.,2016

3. Effect of cooling condition and Ag on the growth of intermetallic compounds in Sn-based solder joints;Ma;Appl. Phys. A,2016

4. Microstructure and opto-electronic properties of Sn-rich Au-Sn diffusive solders;Rerek;Appl. Surf. Sci.,2018

5. Study of electrochemical migration based transport kinetics of metal ions in Sn-9Zn alloy;Ma;Microelectron. Reliab.,2018

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1. Spectroscopic ellipsometry modelling of thin AuSn films and nanostructures as plasmonics materials;Journal of Physics: Conference Series;2024-02-01

2. Laser-induced alloy nanoparticles: Au–Sn thin film morphology influence on the dewetting process;The International Journal of Advanced Manufacturing Technology;2023-10-04

3. Structural, compositional, morphological and electrical characteristics of thermally evaporated Au Ohmic Contact on p-type HgCdTe substrate for possible infrared detectors;Optical Materials;2023-07

4. Laser-induced alloy nanoparticles on Au-Sn thin layers;Applied Surface Science;2022-07

5. Influence of the Microstructure and Optical Constants on Plasmonic Properties of Copper Nanolayers;Materials;2021-11-29

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