Spallation of interfacial Ag–Au–Cu–Zn compounds in Sn–Ag–Cu/Sn–Zn–Bi joints during 210°C reflow
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference35 articles.
1. Phase formation between lead-free Sn–Ag–Cu solder and Ni(P)∕Au finishes
2. Effect of 0.5 wt % Cu in Sn−3.5%Ag Solder Balls on the Solid State Interfacial Reaction with Au/Ni/Cu Bond Pads for Ball Grid Array (BGA) Applications
3. Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu
4. Microstructure and shear strength evolution of Sn-Ag-Cu solder bumps during aging at different temperatures
5. Effects of limited cu supply on soldering reactions between SnAgCu and Ni
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Experimental Investigation of Microstructure and Phase Transitions in Ag-Cu-Zn Brazing Alloys;Journal of Materials Engineering and Performance;2018-03-05
2. Microstructure and kinetic analysis of the properties and behavior of nickel (Ni) nano-particle doped tin–zinc–bismuth (Sn–8Zn–3Bi) solders on immersion silver (Ag)-plated copper (Cu) substrates;Journal of Materials Science: Materials in Electronics;2014-04-06
3. Electrochemical Corrosion Behaviors of Sn-9Zn-3Bi-xCr Solder in 3.5% NaCl Solution;Journal of Electronic Materials;2011-05-06
4. Effect of small Sn–3.5Ag–0.5Cu additions on the structure and properties of Sn–9Zn solder in ball grid array packages;Microelectronic Engineering;2009-11
5. Effect of Ag micro-particles content on the mechanical strength of the interface formed between Sn–Zn binary solder and Au/Ni/Cu bond pads;Microelectronic Engineering;2009-10
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3