Sc2W3O12/Cu composites with low thermal expansion coefficient and high thermal conductivity for efficient cooling of electronics-Reference-Cited by-同舟云学术

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Sc2W3O12/Cu composites with low thermal expansion coefficient and high thermal conductivity for efficient cooling of electronics

Published:2019-03 Issue: Volume:779 Page:108-114
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Gao Shuai,Zhao Nan,Liu Qinqin,Li Yi,Xu Guifang,Cheng Xiaonong,Yang Juan

Funder

National Science Foundation of China

Natural Science Foundation of the Jiangsu Higher Education Institutions

Senior Talent Foundation of Jiangsu University

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference32 articles.

1. Temperature minimization and thermal-driven scheduling for real time periodic tasks;Li;J. Signal Process. Syst.,2018

2. Carbon nanotube-copper exhibiting metal-like thermal conductivity and silicon-like thermal expansion for efficient cooling of electronics;Subramaniam;Nanoscale,2014

3. Thermal conductance through molecular wires;Segal;J. Chem. Phys.,2003

4. Metal-matrix composites for electronic packaging;Zweben;Jom,1992

5. Negative thermal expansion: a review;Miller;J. Mater. Sci.,2009

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2. Sintering Behavior and Thermal Properties of Cu-Graphite Materials by a Spark Plasma Sintering Method;Korean Journal of Metals and Materials;2024-06-05

3. Effects of (KMg)3+ co-doping and sintering temperature on the negative thermal expansion property of Sc2W3O12 ceramics;Ceramics International;2024-06

4. Investigate the effect of C coating on the wetting and reaction mechanism of Sc2W3O12 and AgCuTi filler;Materials Characterization;2024-05

5. Unrevealing the wetting behavior and mechanism of AgCuTi filler on negative thermal expansion Sc2W3O12 materials: Experiments and First-principles calculations;Applied Surface Science;2024-04

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