Retarding the electromigration effects to the eutectic SnBi solder joints by micro-sized Ni-particles reinforcement approach-Reference-Cited by-同舟云学术

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Retarding the electromigration effects to the eutectic SnBi solder joints by micro-sized Ni-particles reinforcement approach

Published:2011-01 Issue:3 Volume:509 Page:878-884
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Xu Guangchen,Guo Fu,Wang Xitao,Xia Zhidong,Lei Yongping,Shi Yaowu,Li Xiaoyan

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference28 articles.

1. Controlling intermetallic compound formation reaction between Sn and Ni–P by Zn addition

2. The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn–Ag–Cu solder on Au/Ni metallized Cu pads

3. Interfacial reaction issues for lead-free electronic solders

4. Effect of underfill on electromigration lifetime in flip chip joints

5. Electric current effect on microstructure of ball grid array solder joint

Cited by 34 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A high-performance TFN membrane prepared by a novel PE support layer, a polydopamine interlayer, and a doped MoS2 quantum dots@ZnO nanocomposites-incorporated polyamide active layer;Journal of Industrial and Engineering Chemistry;2024-07

2. Research Overview on the Electromigration Reliability of SnBi Solder Alloy;Materials;2024-06-11

3. Fractography analysis of Sn-58Bi solder joint after addition of cobalt nanoparticles;Journal of Materials Science: Materials in Electronics;2023-12

4. Microstructure evolution at the interface between Cu and eutectic Sn–Bi alloy with the addition of Ag or Ni;Journal of Materials Research and Technology;2023-09

5. Microstructural evolution of joints with and without Sb, Ni in Sn58Bi solder under electro-thermal-force coupling;Journal of Materials Research and Technology;2023-09

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