Thermodynamic assessment of the Cu–Ge binary system
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference34 articles.
1. Low resistivity copper germanide on (100) Si for contacts and interconnections
2. Vaporization thermodynamics and heat capacities of Cr3Ge and Cr5Ge3
3. Influence of the pre-treatment anneal on Co–germanide Schottky contacts
4. Nickel silicides and germanides: Phases formation, kinetics and thermal expansion
5. Thermal annealing behaviour of platinum, nickel and titanium Schottky barrier diodes on n-Ge (100)
Cited by 34 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Formation of ductile close-packed hexagonal solid solution on improving shear strength of Au–Ge/Cu soldering joint;Transactions of Nonferrous Metals Society of China;2023-08
2. Effects of Ge on microstructure evolution of the Cu-based filler metal and the Cu-20Sn-10Ti-1Ga/diamond brazing mechanism;Welding in the World;2023-01-18
3. Thermodynamic assessment of the thulium-copper-germanium ternary system;XVII MEXICAN SYMPOSIUM ON MEDICAL PHYSICS;2023
4. Concentration dependence of the crystal nucleation kinetics in undercooled Cu–Ge melts;The Journal of Chemical Physics;2022-12-07
5. The Role of Dilute Solute Additions on Growth Restriction in Cu-, Al-, Mg- and Ti-Based Alloys;Metals;2022-09-30
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3