Pulse electrodeposition of copper-manganese alloy in deep eutectic solvent
Author:
Funder
Ministry of Science and Technology of Taiwan
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference38 articles.
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2. Improved reliability of copper interconnects using alloying;Gambino,2010
3. Electrodeposition of copper thin film on ruthenium: a potential diffusion barrier for Cu interconnects;Chyan;J. Electrochem. Soc.,2003
4. Investigation of barrier property of copper manganese alloy on ruthenium;Su;IEEE Trans. on Device and Mater. Reliab.,2015
5. Atomic layer deposited self-forming Ru-Mn diffusion barrier for seedless Cu interconnects;Lee;J. Alloy Compd.,2016
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1. Deep eutectic solvents as green solvents for materials preparation;Green Chemistry;2024
2. Characteristic of CuMn Alloy Films Prepared Using Electrochemical Deposition;Journal of Materials Engineering and Performance;2023-08-07
3. Characteristic of CuMn Alloy Films Prepared by Using Electrochemical Deposition;2022-11-17
4. Deep eutectic solvents as a green toolbox for synthesis;Cell Reports Physical Science;2022-04
5. Electrodeposition of Cu-Mn Films as Precursor Alloys for the Synthesis of Nanoporous Cu;Electrochem;2021-09-13
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