Funder
Ministry of Science and Technology, Taiwan
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference67 articles.
1. Reliability and lifetime evaluation of different wire bonding technologies for high power IGBT modules;Hamidi;Microelectron. Reliab.,1999
2. Design concept for wire-bonding reliability improvement by optimizing position in power devices;Ishiko;Microelectron. J.,2006
3. Present problems of power module packaging technology;Shammas,2003
4. Investigation of ultrasonic copper wire wedge bonding on Au/Ni plated Cu substrates at ambient temperature;Tian;J. Mater. Process. Technol.,2008
5. N.Marenco, M.Kontek, W.Reinert, J.Lingner, M.H.Poech, Copper ribbon bonding for power electronics applications, in: EMPC 2013 - Eur. Microelectron. Packag. Conf. Wind. Roads Electron. Packag., Grenoble, 2013.
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