Effect of in-situ formed Pr-coated Al2O3 nanoparticles on interfacial microstructure and shear behavior of Sn-0.3Ag-0.7Cu-0.06Pr/Cu solder joints during isothermal aging
Author:
Funder
National Natural Science Foundation of China
PAPD
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference32 articles.
1. Effects of α-Al2O3 nanoparticles-doped on microstructure and properties of Sn-0.3Ag-0.7Cu low-Ag solder;Wu;J. Mater. Sci. Mater. Electron.,2018
2. High lead solder (over 85%) solder in the electronics industry: RoHS exemptions and alternatives;Menon;J. Mater. Sci. Mater. Electron.,2015
3. A reliability assessment guide for the transition planning to lead-free electronics for companies whose products are RoHS exempted or excluded;Pecht;Microelectron. Reliab.,2016
4. Microstructural investigations and mechanical properties of pure lead-free (Sn-3.0Ag-0.5Cu and Sn-4.0Ag-0.5Cu) solder alloy;Pal;Metal. Mater. Eng.,2018
5. Effects of trace rare earth Nd addition on microstructure and properties of SnAgCu solder;Gao;J. Mater. Sci. Mater. Electron.,2010
Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Nanoparticle-reinforced solder alloys: A comprehensive review of recent formulation properties, and mechanical performance;Journal of Materials Research and Technology;2024-09
2. Strong composite SnAgCu solder joints with internal aligned carbon fibers by magnetic field;Journal of Materials Processing Technology;2024-05
3. Recent Progress on Thermo-Mechanical Reliability of Sn-Based Alloys and Composite Solder for Microelectronic Interconnection;ACTA METALL SIN;2023
4. Influence of 0.05 wt% Pr addition on interfacial microstructure and mechanical properties of Sn–0.3Ag–0.7Cu/Cu solder joint during thermal shocking;Journal of Materials Science: Materials in Electronics;2022-02-14
5. Self-propagating welding of sapphire and Kovar by NiAl nano multilayers;International Conference on Optoelectronic and Microelectronic Technology and Application;2020-12-04
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3