Funder
Seventh European Frame Programme FP7
AMAZE
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference42 articles.
1. Spray forming of hypereutectic Al–Si alloys;Cui;J. Mater. Process. Technol.,2009
2. Mechanical properties of a low-thermal-expansion aluminum/silicon composite produced by powder metallurgy;Liu;J. Mater. Sci.,2014
3. Future trends in materials for lightweight microwave packaging;Jacobson;Microelectron. Int.,1998
4. A. G. Leatham, J. S. Coombs, J. B. Forrest, A. J. W. Ogilvy, R. Ross, and L. G. Elias, “Silicon alloys for electronic packaging,” Nov. 6 2001. US Patent 6,312,535.
5. Spray forming of aluminum alloys and its composites: an overview;Raju;J. Mater. Sci.,2008
Cited by
38 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献