Future trends in materials for lightweight microwave packaging-Reference-Cited by-同舟云学术

Future trends in materials for lightweight microwave packaging

Published:1998-12 Issue:3 Volume:15 Page:17-21
ISSN:1356-5362
Container-title:Microelectronics International
language:en
Short-container-title:Microelectronics International

Author:

Jacobson David M.,Sangha Satti P.S.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference17 articles.

1. Novel aluminium-silicon alloys for electronics packaging

2. 2Jacobson, D.M and Sangha, S.P.S. “Novel low expansion packages for electronics”,The GEC Journal of Technology, Vol. 14 No. 1, 1997, pp. 48‐55.

3. 3White, D., Keck, S., Smith, I. and Silzars, A. “New ground in hybrid packaging”,Hybrid Circuit Technology, Vol. 12 No. 1, 1990, pp. 14‐19.

4. 5The Carborundum Company,Advanced Semi‐conductor Packaging, Phoenix, AZ, 1992.

5. 11Schmidt, K.A. and Zweben, C. “Application of composites in packages, ”,Electronic Materials Handbook, Vol. 1, Packaging, pp. 1126‐8.

Cited by 20 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Helium sealed hard disk drive;Journal of Magnetism and Magnetic Materials;2022-12

2. A review featuring the fundamentals and advancements of polymer/CNT nanocomposite application in aerospace industry;Polymer Bulletin;2020-01-06

3. Microstructure and properties of 50Si50Al alloy produced by spray deposition and hot pressing process;Ferroelectrics;2019-09-10

4. In-situ alloying of AlSi10Mg+Si using Selective Laser Melting to control the coefficient of thermal expansion;Journal of Alloys and Compounds;2019-07

5. Micromechanical estimation of effective thermal conductivities of metal matrix nanocomposites with local carbon nanotube agglomeration;Journal of Alloys and Compounds;2019-07