Interfacial reaction of Ni3Sn4 intermetallic compound in Ni/SnAg solder/Ni system under thermomigration
Author:
Funder
Ministry of Science and Technology of Taiwan
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference23 articles.
1. Interfacial reactions in the Sb-Sn/(Cu, Ni) systems: wetting experiments;Novakovic;Mater. Chem. Phys.,2012
2. Growth mechanism of Ni3Sn4 in a Sn/Ni liquid/solid interfacial reaction;Shen;Acta Mater.,2009
3. Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization;Min;Acta Mater.,2004
4. The effects of solder volume and Cu concentration on the consumption rate of Cu pad during reflow soldering;Chang;J. Alloys Compd.,2010
5. Thermomigration of Cu–Sn and Ni–Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints;Chen;J. Mater. Res.,2011
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