Thermal and mechanical properties of lead-free SnZn–xNa casting alloys, and interfacial chemistry on Cu substrates during the soldering process
Author:
Funder
National Science Centre Poland
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference53 articles.
1. Structure and properties of lead-free solders bearing micro and nano particles
2. Physical, Thermal, Mechanical Properties, and Microstructural Characterization of Sn-9Zn-XGa Alloys
3. Development of Sn–Zn lead-free solders bearing alloying elements
4. Influence of rapid solidification on microstructure, thermodynamic characteristic and the mechanical properties of solder/Cu joints of Sn–9Zn alloy
5. Design of lead-free candidate alloys for low-temperature soldering applications based on the hypoeutectic Sn–6.5Zn alloy
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1. Effects of Bi Doping on Zn-Rich Phase Evolution and Physical and Chemical Properties of Sn-6.5Zn Lead-Free Solder Alloy;Journal of Materials Engineering and Performance;2024-09-09
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3. The electrochemical corrosion behavior of Sn58Bi-XCr composite solder;Materials Chemistry and Physics;2023-02
4. Effect of Ni on the microstructure and properties of Sn-6.5Zn-3.0Bi solders;Philosophical Magazine;2022-09-02
5. Development of lead-free interconnection materials in electronic industry during the past decades: Structure and properties;Materials & Design;2022-03
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