Silver end termination paste preparation for chip inductor applications
Author:
Funder
ABC electronic Co. Ltd
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference13 articles.
1. Low-temperature sintering of NiZnCu ferrite and its permeability spectra
2. Soft Ferrite Materials for Multilayer Inductors
3. Fabrication of multilayer chip inductors using Ni–Cu–Zn ferrites
4. Handbook of Thick Film Technology;Holmes,1976
5. Interaction between Alumina and Binary Glasses
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