Hot deformation characteristics and processing map of nickel-based C276 superalloy
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference21 articles.
1. Surface modification of Hastelloy C-276 by SiC addition and electron beam melting;Ahmad;J. Nucl. Mater.,2005
2. Microstructure and hardness studies of the electron beam welded zone of Hastelloy C-276;Ahmad;J. Alloys Comp.,2005
3. Hot tensile deformation characteristics and processing map of extruded AZ80 Mg alloys;Lou;J. Mater. Eng. Perform.,2014
4. Modeling of dynamic material behavior in hot deformation: forging of Ti-6242;Prasad;Metall. Trans. A,1983
5. Effect of alloying elements and microstructure on the processing parameters of alpha(2) aluminide alloys;Sagar;Mater. Sci. Eng., A,2006
Cited by 68 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. The improved physically-mechanism constitutive model for a Ni-Mo-Cr-based superalloy with the pre-precipitation of μ phase in hot forming;Journal of Alloys and Compounds;2024-08
2. Hot deformation behavior and processing workability of ERNiCrMo-3 alloy;The International Journal of Advanced Manufacturing Technology;2024-04-15
3. Microstructure evolution of high-temperature deformation behavior of nickel based alloys for advanced ultra-supercritical applications;Materials Chemistry and Physics;2024-02
4. Hot deformation behaviors and microstructure characteristics of Cr–Mo–Ni–V steel with a banded structure;High Temperature Materials and Processes;2024-01-01
5. Study on creep characteristics and the isochronous stress–strain curve of Ni-Cr-Mo superalloy;Materials at High Temperatures;2023-11-02
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3